HEA|  |05319nam a2200385 i 4500
001|  |022018000448
003|  |CAL
005|  |20180515161125.5
008|  |180515s2017    enka     b    001 0 eng d
010|  |▼a  2016942439
020|  |▼a9780857094858▼qhardback
020|  |▼z9780857094865▼qelectronic bk.
040|  |▼aUMI▼beng▼erda▼epn▼cUMI▼dYDX▼-
   |  |dNLE▼dOCLCF▼dOPELS▼dUAB▼dMERER-
   |  |▼dN$T▼dEBLCP▼dIDEBK▼dIDB▼dCOO▼-
   |  |dVT2▼dUPM▼dOH1
050| 4|▼aTS176
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072| 7|▼aTEC▼x035000▼2bisacsh
082|04|▼a620.0045▼223
093|  |▼aTH16▼25
099|  |▼aCAL 022017105830
245|00|▼aMicrofabrication and precisi-
   |  |on engineering :▼bresearch and-
   |  | development /▼cedited by J. P-
   |  |aulo Davim.
264| 1|▼aDuxford, United Kingdom ;▼aC-
   |  |ambridge, MA :▼bWoodhead Publi-
   |  |shing,▼c[2017] 
300|  |▼ax, 272 pages :▼billustrations ;▼c24 cm
490|0 |▼aWoodhead Publishing in Mecha-
   |  |nical Engineering
504|  |▼aIncludes bibliographical ref-
   |  |erences and index.
505|0 |▼aFront Cover; Microfabricatio-
   |  |n and Precision Engineering; C-
   |  |opyright Page; Contents; List -
   |  |of contributors; About the edi-
   |  |tor; Preface; 1 Modeling of mi-
   |  |cro- and nano-scale cutting; 1-
   |  |.1 Introduction; 1.2 Modeling -
   |  |of microscale cutting; 1.2.1 M-
   |  |inimum chip thickness and size-
   |  | effect; 1.2.2 FEM modeling of-
   |  | microscale cutting; 1.2.3 FEM-
   |  | basics; 1.2.4 FEM cutting mod-
   |  |els; 1.2.5 Friction modeling; -
   |  |1.2.6 Material modeling; 1.3 M-
   |  |odeling of nanoscale cutting; -
   |  |1.3.1 Model geometry and mater-
   |  |ial microstructure; 1.3.2 Pote-
   |  |ntial function; 1.3.3 Boundary-
   |  | conditions and input parameters.
505|8 |▼a1.3.4 Numerical integration -
   |  |and equilibrationConclusions; -
   |  |References; 2 Machining scale:-
   |  | workpiece grain size and surf-
   |  |ace integrity in micro end mil-
   |  |ling; 2.1 Introduction; 2.2 Sp-
   |  |ecific cutting energy; 2.3 Siz-
   |  |e effect; 2.4 Workpiece micros-
   |  |tructure scale; 2.5 Surface in-
   |  |tegrity; 2.5.1 Burr formation;-
   |  | 2.5.2 Chip formation; 2.5.3 R-
   |  |oughness; 2.5.4 Microhardness;-
   |  | 2.5.5 Microstructural damages-
   |  |; 2.5.6 Size effect; Reference-
   |  |s; 3 Micromachining technique -
   |  |based on the orbital motion of-
   |  | the diamond tip; 3.1 Introduc-
   |  |tion; 3.2 Principle of microma-
   |  |chining using the orbital moti-
   |  |on of the diamond tip.
505|8 |▼a3.3 Micromachining setup and-
   |  | test of the stage\'s trajector-
   |  |y3.3.1 Establishment of the mi-
   |  |cromachining setup and the mac-
   |  |hining procedure; 3.3.2 Test o-
   |  |f the trajectory of the nanopi-
   |  |ezo stage in the orbital motio-
   |  |n; 3.4 Micromachining mechanis-
   |  |m using the orbital motion of -
   |  |the tip; 3.4.1 Comparison of c-
   |  |hip states with the conical an-
   |  |d pyramidal tips; 3.4.2 Differ-
   |  |ence between the micromilling -
   |  |process and this technique; 3.-
   |  |4.3 Determination of the uncut-
   |  | chip thickness and the cuttin-
   |  |g rake angle; 3.5 Formation me-
   |  |chanism and control methods of burrs.
505|8 |▼a3.5.1 Burr formation during -
   |  |machining with the conical tip-
   |  |3.5.2 Burr formation during ma-
   |  |chining with the pyramidal tip-
   |  |; 3.5.3 Methods of formation o-
   |  |f slight burrs; 3.6 Effects of-
   |  | the processing parameters and-
   |  | fabrication of microstructure-
   |  |s; 3.6.1 Effects of the proces-
   |  |sing parameters on machining m-
   |  |icrochannels; 3.6.2 Effect of -
   |  |the feed on machining microstr-
   |  |uctures; 3.6.3 Fabrication of -
   |  |typical microstructures; 3.7 S-
   |  |ummary and future works; Ackno-
   |  |wledgments; References; 4 Micr-
   |  |oelectrical discharge machinin-
   |  |g of Ti-6Al-4V: implementation-
   |  | of innovative machining strat-
   |  |egies; 4.1 Introduction.
505|8 |▼a4.2 Principle of electrical -
   |  |discharge machining4.3 Overvie-
   |  |w of micro-EDM; 4.4 Difference-
   |  |s between EDM and micro-EDM; 4-
   |  |.5 System components of micro－－
   |  |EDM; 4.5.1 Pulse generator; 4.-
   |  |5.2 Servo control unit; 4.5.3 -
   |  |Dielectric circulating unit; 4-
   |  |.6 Micro-EDM process parameter-
   |  |s; 4.6.1 Electrical process pa-
   |  |rameters; 4.6.1.1 Discharge en-
   |  |ergy; 4.6.1.2 Gap and discharg-
   |  |e voltage; 4.6.1.3 Peak curren-
   |  |t; 4.6.1.4 Pulse duration; 4.6-
   |  |.1.5 Duty factor; 4.6.1.6 Puls-
   |  |e frequency; 4.6.1.7 Polarity;-
   |  | 4.6.2 Nonelectrical process p-
   |  |arameters; 4.6.2.1 Tool electr-
   |  |odes; 4.6.2.2 Workpiece materi-
   |  |als; 4.6.2.3 Dielectric fluids.
520|  |▼aMicrofabrication and precisi-
   |  |on engineering is an increasin-
   |  |gly important area relating to-
   |  | metallic, polymers, ceramics,-
   |  | composites, biomaterials and -
   |  |complex materials. Micro-elect-
   |  |ro-mechanical-systems (MEMS) e-
   |  |mphasize miniaturization in bo-
   |  |th electronic and mechanical c-
   |  |omponents. Microsystem product-
   |  |s may be classified by applica-
   |  |tion, and have been applied to-
   |  | a variety of fields, includin-
   |  |g medical, automotive, aerospa-
   |  |ce and alternative energy. Mic-
   |  |rosystems technology refers to-
   |  | the products as well as the f-
   |  |abrication technologies used i-
   |  |n production.With detailed inf-
   |  |ormation on modelling of micro-
   |  | and nano-scale cutting, as we-
   |  |ll as innovative machining str-
   |  |ategies involved in microelect-
   |  |rochemical applications, micro-
   |  |channel fabrication, as well a-
   |  |s underwater pulsed Laser beam-
   |  | cutting, among other techniqu-
   |  |es, Microfabrication and Preci-
   |  |sion Engineering is a valuable-
   |  | reference for students, resea-
   |  |rchers and professionals in th-
   |  |e microfabrication and precisi-
   |  |on engineering fields.Contains-
   |  | contributions by top industry-
   |  | experts; Includes the latest -
   |  |techniques and strategies; Spe-
   |  |cial emphasis given to state-o-
   |  |f-the art research and develop-
   |  |ment in microfabrication and p-
   |  |recision engineering.－－Back cover.
650| 0|▼aProduction engineering.
650| 0|▼aMicrotechnology.
650| 0|▼aNanotechnology.
700|1 |▼aDavim, J. Paulo,▼eeditor.
998|  |▼aNPU

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